|TCAD Reception at IEDM 2013|
After a day of conference sessions, attend the Synopsys reception. It’s a great opportunity for you to relax and enjoy complimentary food and beverages while catching up with colleagues. Also, don’t miss the chance to ask a Synopsys TCAD staff member a pressing question.
Dec 10, 2013
|3-D ASIP Conference|
3D Architectures for Semiconductor Integration and Packing (3D ASIP) is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the techno-market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena.
Dec 11-13, 2013