Articles 



EDACafe: USB 3.1: Synopsys still King of the Hill
Oct 30, 2014

Tech Design Forum: 10Gbit/s USB 3.1 IP and verification support on the way
Oct 29, 2014

SemiWiki: Who Really Needs USB 3.1?
Oct 29, 2014

DesignWare Technical Bulletin: USB 3.1: Physical, Link, and Protocol Layer Changes -
Oct 28, 2014

DesignWare Technical Bulletin: HDMI and MHL IP for Mobile and Digital Home Connectivity -
Oct 28, 2014

DesignWare Technical Bulletin: Assess Analog Front-End Performance in Communication SoCs -
Oct 28, 2014

DesignWare Technical Bulletin: Verifying ARM AMBA ® 5 CHI Interconnect-Based SoCs Using Next-Generation VIP
Oct 28, 2014

DesignWare Technical Bulletin: LPDDR4 for a Better Power/Performance Balance –
Oct 28, 2014

DesignWare Technical Bulletin: ARC Insider: Designing Processors for High-Performance Embedded Linux Applications
Oct 28, 2014

SemiWiki: Two New Announcements at ITC from Synopsys
Oct 22, 2014

Electronic Design: MIPI D-PHY v1.2 Helps Save Cost, Power in Image-Sensor and Display Apps
Oct 21, 2014

Tech Design Forum: Finding and fixing faults in finFET memories
Oct 14, 2014

SemiWiki: MIPI Alliance introduces C-PHY, Synopsys launch C-PHY VIP the same day
Sep 18, 2014

Semiconductor Engineering: Advances In Power Management For Physical IP In 28nm And FinFET Process Nodes
Sep 11, 2014

Tech Design Forum: Six key criteria for deciding to migrate to a finFET process
Aug 27, 2014

SemiWiki: FinFETs for your Next SoC
Aug 24, 2014

SemiWiki: USB 3.0 IP on FinFET may stop port pinching
Aug 19, 2014

SemiconductorEngineering: Changing The IP Supplier Paradigm
Aug 07, 2014

SemiWiki: How to Trim Automotive Sensor?
Jul 30, 2014

Electronic Design: LPDDR4 DRAM Meets Mobile Power and Performance Demands
Jul 28, 2014

SemiconductorEngineering: IP Integration Challenges Rising
Jul 24, 2014

Automotive DesignLine: Is Your Processor IP ISO 26262-Compliant?
Jul 21, 2014

Electronic Design: Apply IEEE 1500 to Integrate Multiple JTAG Chains in SoCs
Jul 17, 2014

DesignWare Technical Bulletin: IP Accelerated: IP Integration with Less Effort, Lower Risk, and Faster Time-to-Market
Jul 11, 2014





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