The third product in the process-aware design-for-manufacturing (PA-DFM) family is Fammos; the first special-purpose TCAD PA-DFM tool that analyzes stress evolution for the entire fabrication process of interconnects. Fammos performs 3D backend process simulations using design database and process recipes. With specialized algorithms for fast 3D structure construction, mesh generation, and equation solving, Fammos predicts interconnect stress distributions from multiple stress sources and accounts for proximity effects. Combining the best-in-class capabilities from Synopsys, Fammos is capable of detecting stress hot spots that are susceptible to debonding, voiding and cracking. It employs a set of physics-based models to evaluate reliability failures. Using the Sentaurus Workbench user interface, Fammos will facilitate technology explorations with parameterized input files and scheduled run splits.

Benefits

• Generate 3D structures using design database and process steps
• Analyze stress evolution for the entire fabrication process
• Account for multiple stress sources and proximity effects
• Evaluate failures related to debonding, cracking and stress voiding
• Perform technology explorations for yield and reliability improvements
• Rank designs and extract reliability-based design rules (in future releases)
• Offer third-party capability as a result of its modular structure (in future releases)