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探索芯片设计、验证和制造解决方案

先进的芯片为我们每天依赖的卓越软件提供强力支持。从智能手机、可佩戴设备、智能医疗设备，到无人驾驶汽车，芯片是一切的基础。

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从基于标准的 IP 核到完整的定制架构，新思科技拥有值得信赖的 IP 核和子系统专家，能够满足您独特的芯片需求。

探索系统和芯片验证

新思科技是全球领先的硬件加速验证和虚拟化解决方案提供商

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人工智能 | 智能汽车 | 高性能计算

Blog

1 min read / Mar 25, 2024

2024冲上热搜的科技爆点：GenAI加入芯片设计与验证

By Stelios Diamantidis

Tags: AI & Machine Learning

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Blog

1 min read / Feb 20, 2024

新思科技+英飞凌，携手破解智能汽车密码

By Hezi Saar

Tags: Automotive

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Blog

1 min read / Feb 06, 2024

最复杂春运天，把车水马龙龙龙龘龘龘放在“芯”上

By William Ruby

Tags: Automotive

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Blog

1 min read / Jan 15, 2024

2024汽车行业新玩法，新老玩家皆宜

By Chris Clark , Stewart Williams

Tags: Automotive

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Blog

1 min read / Sep 19, 2023

提高效率，突破创新：微软和意法半导体凭什么？

By Rikki Lu

Tags: Cloud, AI & Machine Learning, Chip Design Insights, Design, Verification

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Blog

1 min read / Aug 23, 2023

ChatGPT生成的代码能否直接用？AI代码分析工具让开发者不再“版权焦虑”

By Rikki Lu

Tags: AI & Machine Learning, Chip Design Insights

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AI芯片设计及验证

Blog

1 min read / Feb 21, 2024

新思科技与三星联手给出5nm移动低功耗芯片一次性流片成功的解题思路

By Chiragkumar Patel , Avinash Palepu

Tags: Verification

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Blog

1 min read / Jan 30, 2024

RISC-V HPC内核从5nm迁移到4nm，1个月还是2天？

By Manas Ranjan Raiguru

Tags: Verification

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Blog

1 min read / Jan 23, 2024

低功耗仿真必须要克服的X问题

By Rob van Blommestein

Tags: Verification

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Blog

1 min read / Jan 22, 2024

低功耗探索不能停，用高能效SoC建设节能未来

By William Ruby

Tags: Low Power, Design

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Blog

1 min read / Sep 25, 2023

Synopsys.ai再拓新版图！新思科技发布业界首个全栈式大数据分析解决方案

By Rikki Lu

Tags: Chip Design Insights, Design, Verification

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Blog

1 min read / Sep 19, 2023

提高效率，突破创新：微软和意法半导体凭什么？

By Rikki Lu

Tags: Cloud, AI & Machine Learning, Chip Design Insights, Design, Verification

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Blog

1 min read / Sep 13, 2023

新思科技和三星强强联手，加速先进工艺下多裸晶芯片系统设计

By Rikki Lu

Tags: Chip Design Insights, Design, Silicon IP, Verification

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Blog

1 min read / Sep 05, 2023

基于VC Formal，在RISC-V内核上，验证一波！

By Rikki Lu

Tags: Chip Design Insights, Verification

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Blog

1 min read / Aug 30, 2023

新思科技成功收购PikeTec，持续扩大自动驾驶全球领导地位

By Rikki Lu

Tags: Chip Design Insights, Verification, Inside Synopsys

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IP

新思科技与世芯科技携手，以Soft Chiplet革命性简化了Multi-Die设计成功路径

Blog

1 min read / Oct 21, 2024

新思科技与世芯科技携手，以Soft Chiplet革命性简化了Multi-Die设计成功路径

By Manmeet Walia , Manuel Mota , Erez Shaizaf

Tags: Multi-Die System, Silicon IP

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AI加速技术：Synaptics利用新思科技QIK和DSO.ai“热启动”成功迁移至ARC HS58x3

Blog

1 min read / Oct 14, 2024

AI加速技术：Synaptics利用新思科技QIK和DSO.ai“热启动”成功迁移至ARC HS58x3

By Rob van Blommestein

Tags: Silicon IP

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Blog

1 min read / Mar 28, 2024

小芯片互联迈出关键一步！UCIe IP 成功实现跨厂商互操作

By Manuel Mota

Tags: Silicon IP

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Blog

1 min read / Jan 28, 2024

开箱即用，为DDR DRAM一键开启硬件保护罩

By Dana Neustadter , Brett Murdock

Tags: Silicon IP

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Blog

1 min read / Jan 11, 2024

LPDDR5X来袭！准备迎接内存速度大爆炸

By Graham Allan

Tags: Silicon IP

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Blog

1 min read / Sep 13, 2023

新思科技和三星强强联手，加速先进工艺下多裸晶芯片系统设计

By Rikki Lu

Tags: Chip Design Insights, Design, Silicon IP, Verification

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Blog

1 min read / Aug 24, 2023

加速先进制程设计创新！新思科技IP成功在台积公司3nm工艺实现流片

By Rikki Lu

Tags: Chip Design Insights, Silicon IP

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Blog

1 min read / Aug 18, 2023

新思科技与英特尔扩大战略合作，以关键IP组合赋能Intel 3/18A先进制程

By Rikki Lu

Tags: Silicon IP

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Blog

1 min read / Aug 15, 2023

新思科技PVT IP：从源头解决先进制程芯片“三大拦路虎”

By Rikki Lu

Tags: Chip Design Insights, Silicon IP

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Multi-Die系统

Blog

1 min read / Oct 21, 2024

新思科技与世芯科技携手，以Soft Chiplet革命性简化了Multi-Die设计成功路径

By Manmeet Walia , Manuel Mota , Erez Shaizaf

Tags: Multi-Die System, Silicon IP

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Blog

1 min read / Feb 27, 2024

不是系统改版做不起，而是提前架构探索更有性价比

By Kamal Desai

Tags: Multi-Die System

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Blog

1 min read / Feb 07, 2024

都是3D封装，飞在天上的芯片和地上的有什么不一样？

By Kenneth Larsen , Ian Land , Rob Aitken

Tags: Multi-Die System

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Blog

1 min read / Jan 12, 2024

万物智能时代，2024 年关于Multi-Die系统的四大猜想

By Shekhar Kapoor

Tags: Multi-Die System

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Blog

1 min read / Dec 26, 2023

从数月到几小时，这枚Multi-Die系统芯片是如何快速交付的？

By Leonard Drucker , Filip Thoen , Vivek Prasad

Tags: Multi-Die System

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Blog

1 min read / Dec 12, 2023

Multi-Die系统验证很难吗

By Arturo Salz , Dr. Johannes Stahl

Tags: Multi-Die System

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Blog

1 min read / Sep 26, 2023

VCS：助力英伟达开启Multi-Die系统仿真二倍速

By Rikki Lu

Tags: Multi-Die System

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Blog

1 min read / Sep 21, 2023

芯片的数字孪生：虚拟原型技术让Multi-Die系统设计轻松实现

By Rikki Lu

Tags: Multi-Die System, Chip Design Insights

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Blog

1 min read / Aug 14, 2023

新思科技CEO Aart de Geus：SysMoore时代，Multi-Die系统将重塑半导体未来

By Rikki Lu

Tags: Multi-Die System, Chip Design Insights

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光学设计软件

Blog

1 min read / Mar 26, 2024

迈凯伦都在用的“实用+美学”宝藏级车灯设计方案是什么？

By Thorsten Schupp

Tags: Optical

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Blog

1 min read / Feb 01, 2024

从概念到现实：真实感渲染技术让设计效率飙升，告别粗糙原型

By Marion Gaboriau Gil

Tags: Optical

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Blog

1 min read / Dec 20, 2023

以“光”为媒感知世界，探寻激光雷达的光学奥秘

By Guanyi Wang

Tags: Optical

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Blog

1 min read / Aug 09, 2023

“外卷”超透镜如何看见AR/VR的星辰大海

By Rikki Lu

Tags: Optical

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Blog

1 min read / Jul 17, 2023

解锁光学设计“隐藏”功能，拉满“技能点”进阶光学高手

By Rikki Lu

Tags: Chip Design Insights, Optical

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Blog

1 min read / May 17, 2023

测量材料表面，就可以提升光学设计精确度？

By Wenjun Ni

Tags: Optical

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Blog

1 min read / Mar 20, 2023

AR光学技术，打开虚拟与现实的任意门

By Wenjun Ni

Tags: Chip Design Insights, Optical

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Blog

1 min read / Dec 06, 2022

当镜头设计遇上数字孪生

By Emilie Viasnoff

Tags: Optical

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Blog

2 min read / Nov 16, 2022

如何照亮汽车前行之路

By Guanyi Wang

Tags: Optical

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