Oct 21, 2024/1 min read 新思科技与世芯科技携手,以Soft Chiplet革命性简化了Multi-Die设计成功路径 By Manmeet Walia, Manuel Mota, Erez Shaizaf Tags: Multi-Die System, Silicon IP
Feb 07, 2024/1 min read 都是3D封装,飞在天上的芯片和地上的有什么不一样? By Kenneth Larsen, Ian Land, Rob Aitken Tags: Multi-Die System
Dec 26, 2023/1 min read 从数月到几小时,这枚Multi-Die系统芯片是如何快速交付的? By Leonard Drucker, Filip Thoen, Vivek Prasad Tags: Multi-Die System
Sep 21, 2023/1 min read 芯片的数字孪生:虚拟原型技术让Multi-Die系统设计轻松实现 By Rikki Lu Tags: Multi-Die System, Chip Design Insights
Aug 14, 2023/1 min read 新思科技CEO Aart de Geus:SysMoore时代,Multi-Die系统将重塑半导体未来 By Rikki Lu Tags: Multi-Die System, Chip Design Insights
Jul 13, 2023/1 min read 设计更简单,运行更稳健,UCIe标准如何“拿捏”Multi-Die系统? By Rikki Lu Tags: Multi-Die System, Chip Design Insights, Design, Silicon IP, Verification
Jun 27, 2023/1 min read 新思科技携手力积电,以3DIC解决方案将AI推向新高 By Rikki Lu Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Verification
Jun 16, 2023/1 min read 晶体管的第一个76年:变小了,却变大了? By Wenjun Ni Tags: Multi-Die System, Chip Design Insights, Design, Verification
Jun 12, 2023/1 min read Multi-Die如何引领后摩尔时代的创新? By Wenjun Ni Tags: Multi-Die System, Chip Design Insights
May 30, 2023/1 min read 《麻省理工科技评论》:38%的半导体公司将采用Multi-Die系统 By Wenjun Ni Tags: Multi-Die System, Chip Design Insights
May 24, 2023/1 min read Multi-Die系统设计里程碑:UCIe PHY IP在台积公司N3E工艺上成功流片 By Wenjun Ni Tags: Multi-Die System, Chip Design Insights, Design, Silicon IP, Verification
May 12, 2023/1 min read 为何AI需要新的芯片架构? By Wenjun Ni Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Verification
Mar 27, 2023/1 min read 芯片革命:Multi-Die系统引领电子设计进阶之路 By Wenjun Ni Tags: Multi-Die System, Chip Design Insights, Silicon IP
Feb 07, 2023/1 min read 2023是否会成为Multi-Die的腾飞之年? By Guanyi Wang Tags: Multi-Die System, Chip Design Insights, Design, Silicon IP, Verification
Jan 11, 2023/1 min read @开发者,2022年这些技术创新,让芯片设计无忧 By Guanyi Wang Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, HPC, Data Center, Silicon IP, Verification
Nov 02, 2022/1 min read UCIe生态正在完善,Chiplet腾飞指日可待 By Guanyi Wang Tags: Multi-Die System, Chip Design Insights, Silicon IP
Oct 05, 2021/1 min read 何为多裸晶设计——为何越来越受欢迎? By Synopsys Editorial Staff Tags: Multi-Die System, Chip Design Insights, Design, Verification
Sep 01, 2021/1 min read 3DIC为后摩尔时代追求更优PPA提供理想平台 By Synopsys Editorial Staff Tags: Multi-Die System, Chip Design Insights, Design, Verification
Jul 06, 2020/1 min read 终结单裸片时代? By Synopsys Editorial Staff Tags: Multi-Die System, Chip Design Insights, 5G Wireless, Silicon IP