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Silicon-proven Die-to-Die IP solution:
What You Need to Know About Gate-All-Around Designs
Securing IoT Devices & Their Connectivity with All-in-One Synopsys and G+D Solution
CXL 2.0: How XConn Expands Data Center Bandwidth
Synopsys Expands Semiconductor IP Portfolio With Acquisition of Intrinsic ID
Synopsys Launches Industry’s First Complete 1.6T Ethernet IP Solution
Packetcraft and Synopsys Collaborate to Deliver Turnkey Bluetooth 5.4 Qualified Solution
Getting Ready for PCIe and Ethernet Over Linear Pluggable Optics
Final Frontier: The Next Generation of 3DIC Interposer InFO Design
Enabling SoC Security and Reliability for HPC, AI & IoT with NVM OTP IP in TSMC N5
PCIe 7.0 data rate performance at 128Gbps and PCIe 6.0 Demos at DesignCon 2024
224G and 112G Ethernet PHY IP enable 800Gbps and beyond at DesignCon 2024
Synopsys 112G PHY IP Electro Optical Electrical Link at ECOC 2023
Power Supply Noise Effects on Jitter for Memory Interfaces
ESD Co-Design for High-Speed SerDes in FinFET Technologies
Software Self-test as a Safety Mechanism for Processing Units
XConn Achieves First-Pass Silicon Success for CXL Switch SoC with Synopsys CXL and PCI Express IP Products
Novatek Achieves First-Pass Silicon Success for Mobile Display SoC
Achronix Achieves First-Pass Silicon Success for High-Performance Computing FPGAs
How Are the Standards for the Terabit Era Defined?
The Role of Synopsys High-Speed SerDes for Future Ethernet Applications
An All Inclusive Journey to HPC/Data Center Silicon Success
Technical Bulletin NEW Articles: PCIe, Automotive, ARC NPX Processors, 3DIO, USB4 & SLM IP