Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Multi-die designs using 2.5D and 3D technologies are increasingly important for a wide range of electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, and mobile. The multi-die architecture enables designers to mix dies from different foundries and technology nodes, including existing dies from previous projects. The resulting density and interconnect speeds are much greater than those achievable with traditional discrete dies. Of course, like any advanced technologies, multi-die designs present new issues to be addressed.

This white paper focuses on multi-die:

• Extraction and Timing Signoff
• Power Signoff
• Physical Signoff

Develop large, complex multi-die designs without fear of surprises when the assembled parts arrive in the bring-up lab.