Synopsys Cloud
Cloud native EDA tools & pre-optimized hardware platforms
Request a Free Trial →
Driving the Next Wave of Semiconductor Innovation
Synopsys is driving the industry transformation from monolithic system-on-chips (SoCs) to multi-die designs with a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust die-to-die connectivity, and improved manufacturing and reliability.
What's New
Discover the latest resources for multi-die design success
Reach New Levels of Performance with Optimized System Power Using Synopsys Multi-Die Solution
Download Brief
Key Benefits
Early Architecture Exploration for Multi-Die Designs
To realize best system performance for the target workloads, designers must efficiently explore the appropriate partitions and system-level interconnect fabric. Reusing IP effectively to meet time-to-market and ensuring testability are among some of the challenges that require fast and early analysis-driven exploration. With early architecture exploration and analysis, system designers can optimize partitioning for the best performance, minimize interconnect traffic, and perform efficient power and thermal planning.
Related Products
Software Development for Multi-Die Designs
Software teams can quickly develop, integrate, and test the software by having access to proven virtual die models. Assembling virtual models in a multi-die prototype allows for efficient software bring-up, debug, and analysis. Software teams can run large amounts of software in lockstep with the hardware using a unified, hybrid emulation and prototype environment.
Related Products
Design Implementation & IP for Multi-Die Designs
To mange the implementation complexity of tens to hundreds of millions of die interconnections, designers require a highly integrated and scalable co-design and analysis platform. This platform can help designers in efficiently exploring, implementing, and analyzing their multi-die designs. To assemble known good dies in an advanced package quickly, designers need standards-compliant IP that offers optimized latency and PPA.
Related Products
Featured Resources
- Enabling Efficient Multi-Die Design Implementation and IP Integration
- UCIe Standard vs. UCIe Advanced: What Designers Need to Know
- Requirements for Multi-Die System Success [6 Part Series]
- Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip
- Addressing Multi-Physics Effects for High-Performance Multi-Die Designs
- Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
Manufacturing & Health for Multi-Die Designs
Designers can help improve the long-term health and reliability by testing, diagnosing, repairing, calibrating, and improving operational metrics at every phase of the multi-die lifecycle. In addition, access to traceability and analytics across the dies for in-design, in-ramp, in-production and in-field optimization can help designers improve cost, quality, and reliability. Allow binning of high-quality and high-performing dies for consideration during package assembly.
Ecosystem Partners
Learn about our collaboration with our ecosystem partners in multi-die designs
Featured Resources
Looking for more resources to help with your multi-die designs? Explore our resources.
Resource Library
Explore videos, whitepapers, podcasts, and webinars to enhance your understanding and utilization of multi-die designs.
Explore Our Insights
Stay updated with Synopsys blogs featuring the newest trends and innovations in multi-die designs.
Frequently Asked Questions
What is multi-die technology?
Multi-die technology integrates multiple heterogeneous dies (or chiplets) into a single package. Each die typically performs a specific function, and they are interconnected via standards such as Universal Chiplet Interconnect Express (UCIe) to form a cohesive system. Multi-die technology offers flexibility, scalability, and cost-effectiveness compared to traditional monolithic chip designs.
How does multi-die technology differ from traditional monolithic chip design?
In traditional monolithic chip design, all components are fabricated on a single piece of semiconductor material. In contrast, multi-die technology assembles multiple heterogeneous dies, fabricated on different foundry processes, into a single package. This allows for greater customization, mix-and-match of technologies, and improved yield management.
What are the benefits of using multi-die technology?
Multi-die technology accelerates scaling of system functionality, reduces risk and time-to-market by re-using proven dies, lowers system power while increasing throughput, and offers new product variants for flexible portfolio management.
How does Synopsys address the challenges of multi-die design?
Synopsys offers a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and improved manufacturing and reliability.
What products does Synopsys provide within its multi-die solution?
Synopsys offers a range of products within its multi-die solution. These products help SoC and system architects and designers overcome challenges of multi-die design in the areas of architecture exploration, die/package co-design, multi-physics analysis, software development and validation, verification, die-to-die IP, test and repair, system signoff, and silicon lifecycle management.
Is the Synopsys Multi-Die Solution compatible with industry-standard design methodologies and EDA tools?
Yes, Synopsys multi-die solution supports interoperability with common design formats, interfaces, and standards, some of which include 3Dblox and UCIe.
What support and resources does Synopsys provide for users adopting multi-die technology?
Synopsys offers comprehensive technical support, training programs, documentation, and community forums to assist users in adopting and mastering multi-die design methodologies using its solution. This includes access to expert application engineers, online resources, and user forums for sharing best practices and troubleshooting common issues.