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2023 论文集

2023 论文集

Presentations

基于Redhawk-SC Fusion的IR driven Placement帮助芯片实现IR-Drop Signoff

模拟设计工艺迁移——AI优化和物理实现

AI加持全新一代自主化验证技术

方寸之间的精确：面向先进工艺的核签创新

新思科技高效故障注错仿真工具Z01X助力功能安全验证

Synopsys FUSA 流程帮助客户实现车规项目快速收敛

智能汽车时代如何构建可信软件

利用Fusion Compiler和DSO.ai优势叠加，为高性能ARM CPU获取最大性能和设计生产力

构建可信的终端OS

瞩目ARVR光学系统，先见未来新“视”界

复杂电路仿真问题——高频、波动、电源仿真经验探讨

ZeBu Server 5——业界最快的超大规模硬件仿真系统

使用新思科技TestMAX解决所有测试的限制

一个高效的外部Memory Die的测试方案，以及基于HPC芯片应用的案例分析

图形化通用信号完整性分析环境使用经验

Fusion+DSO.ai+DesignDash打造芯片数字孪生，AI助力RISC-V内核5nm大数据加速4nm设计

VC SpyGlass层次化流程加速DPU大芯片的CDC和RDC验证收敛效率

RTL Architect——快速精准预测PPA，助力提升代码质量

基于新思科技RISC-V解决方案的高效SoC开发

使用StarRC新方案加速项目收敛: GPD与StarReducer