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Table of Contents
Definition
Universal Chiplet Interconnect Express (UCIe), is a standard designed to facilitate high-bandwidth communication between heterogeneous chiplets, in a single package. As the semiconductor industry continues to push the boundaries of performance, power efficiency, and cost-effectiveness, UCIe emerges as a critical die-to-die technology for achieving these goals.
By providing a standardized interface, UCIe enables seamless interoperability between chiplets from different vendors, thereby advancing a more modular and scalable approach to multi-die design.
Figure 1: Companies join forces to establish a complete standardized die-to-die interconnect (Source: www.uciexpress.org)
How Does UCIe Work?
UCIe operates by defining a comprehensive set of protocols and physical layer specifications that govern the communication between chiplets. This standard ensures that data can be transmitted at high speeds with minimal latency and power consumption. The key components of UCIe include:
- Physical Layer: This layer deals with the electrical characteristics and signaling methods used for data transmission. UCIe specifies a high-speed, low-power physical layer that supports data rates of up to 32Gbps per pin, as per the v2.0 specification.
- Die-to-Die Adapter Layer: The adapter layer takes care of link management functionality as well as protocol arbitration and negotiation. It includes the optional error correction functionality which is based on a CRC and retry mechanism.
- Protocol Layer: The protocol layer defines the rules and conventions for data exchange, including command sets and response formats. This layer ensures compatibility between chiplets from different manufacturers.
Figure 2: The UCIe specification layering
UCIe's modular architecture allows for easy integration and scalability, making it an ideal solution for a wide range of applications, from high-performance computing to consumer electronics.
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Benefits of UCIe
UCIe offers a multitude of benefits that make it an attractive choice for multi-die designs. Here are some of the key advantages:
- High Bandwidth: UCIe supports data rates of up to 32Gbps per pin as per the v2.0 specification, enabling ultra-fast communication between chiplets.
- Low Latency: The standard's efficient protocols minimize latency, ensuring quick data transfer and responsiveness.
- Power Efficiency: UCIe's low-power physical layer helps reduce overall power consumption, making it suitable for energy-sensitive applications.
- Scalability: Its modular architecture allows for easy scaling, accommodating future advancements in chiplet technology.
- Interoperability: By providing a standardized interface, UCIe ensures seamless interoperability between chiplets from different vendors.
- Cost-Effectiveness: The ability to mix and match chiplets from various sources can lead to significant cost savings in chip design and manufacturing.
- Packaging Technologies: The ability to make power and performance tradeoffs by supporting organic substrate and high-density advanced packaging technologies.
UCIe and Synopsys
Synopsys offers a complete UCIe IP solution that includes the controller, PHY, and verification IP. Our UCIe IP operates at 40Gbps per pin while remaining fully compliant with the UCIe specification. This comprehensive solution ensures that designers can seamlessly integrate UCIe into their chip designs, achieving high performance and efficiency.
Synopsys' UCIe IP solutions are designed to meet the highest standards of quality and reliability. By leveraging our extensive expertise in semiconductor design and verification, we provide our customers with the tools they need to succeed in the rapidly evolving landscape of multi-die designs.
Synopsys UCIe IP Solution
High-Quality IP Solution for Fast and Reliable Die-to-Die Connectivity
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