EDAリーディング・カンパニーのシノプシスがお届けするソリューション/サービス
高品質IPで皆様のシリコンでの成功を加速
シノプシスは、ハードウェア・アシスト検証ならびに仮想プロトタイピング・ソリューションのリーディングカンパニーです
Accelerate Multi-Die Designs with Industry’s First Complete HBM3 IP and Verification
Achronix Achieves First-Pass Silicon Success with Synopsys IP
Synopsys Announces Industry's Lowest Latency Die-to-Die Controller IP
Enabling SoC Security and Reliability for HPC, AI & IoT with NVM OTP IP in TSMC N5
The Path to 1.6TbE with 224G Ethernet PHY IP
Embedded Applications Get a Helping Hand: Extensible Processor Architectures
Design Success with Foundation IP & Fusion Compiler
AI SoC Chats: Protecting Data with Security IP
AI SoC Chats: Scaling AI Systems with Die-to-Die Interfaces
Verification and Validation of Automotive Safety Element out of Context
Co-Packaged Optics and the Evolution of Switch/Optical Interconnects in Data Centers
Holistic Verification and Validation of Automotive IP for Functional Safety SoCs
シノプシス& 京セラドキュメントソリューションズ
エヌエスアイテクスが自動運転用SoC向けに複数のRISC-Vベース・カスタムプロセッサを開発
Orbbec Achieves First-Pass Silicon Success for 3D Camera
How Die-to-Die Connectivity Is Advancing High-Performance Computing
Quantifying the Benefits of AI in Edge Computing
Which Chip Interconnect Protocol is Better?
Technical Bulletin: Super Resolution, Cloud Computing, CXL, DDR, GPIO, ASIPs